세미나안내

[2018 04 09] 특별세미나 _Ph.D Seung Kwon Seol (KERI)

Multiple-materials 3D printing with Functional Inks for 3D Printed Electronics

관리자 | 2018.04.05 09:34 | 조회 496


Multiple-materials 3D printing with Functional Inks for 3D Printed Electronics

 

 Date: 2018. 04. 09(Mon) , 15:30 ~ 17:00

 Place: Science Building, Room.102 Multimedia Room

 Speaker: Ph.D Seung Kwon Seol (KERI)

Host of a Seminar: Prof. Unyong Jeong

Abstract:

 

“Printed electronics” is the term used to describe electronic circuits and devices, such as RFID tag antennas, sensors, transistors, batteries, and conductive traces that are manufactured via printing techniques. Conventional printing techniques such as screen, gravure, and inkjet printing, offer a rapid and cheap way of fabricating electrical circuits on diverse flexible substrates. Furthermore, the advances in functional nanomaterials, which are included in the ink, have led to the rapid development of printed electronics in recent years. To date, printed electronics have introduced excellent opportunities for the creation of advanced products, which are developed by adding electronic functions to flexible substrates composed of materials such as plastics, rubber, or paper. However, conventional printing methods are limited to the patterning of two-dimensional (2D) or low aspect-ratio structures on flat substrates only, whereas three-dimensional (3D) patterning on non-flat substrates is essential for advanced applications.

3D printing, also known as additive manufacturing, is widely regarded as a revolution in manufacturing technology, with significant promise for electronic applications; this field is known as 3D printed electronics. However, it is difficult to obtain functional 3D structures for electronics, although we can easily produce plastic or metallic 3D objects with coarse resolution via various commercial 3D printing methods, such as stereolithography (SLA), fused deposition modeling (FDM), or selective laser sintering (SLS). Finding the appropriate printing approach for the achievement of functional 3D structures with high spatial resolution remains one of the major challenges in the field of 3D printed electronics.

Here, we demonstrate a novel strategy for multiple-materials 3D printing at room temperature in ambient air conditions. The 3D micro- and nanoarchitectures are printed by an omnidirectional accurate control of a micropipette (“fountain-pen”) filled with a solution (“ink”). A simple modulation of the ink leads to 3D printing for multiple-materials, such as

graphene, carbon nanotube (CNT), metal oxide, metal and even their composite. The employed printing technique is based on the simple procedure: when the fountain-pen touches the substrate, a meniscus of the ink is created outside its opening and the solvent is evaporated at the same time. As the fountain-pen is pulled away, the meniscus is stretched and its cross section decreases. In case of conducting polymer, CNT, graphene, silver and their composite, microarchitectures are formed by a van der waals force between substances during solvent evaporation. On the other hands, 3D copper microstructures are fabricated by a meniscus-guided electrodeposition. The feature of grown metallic structure (i.e. dense or hollow feature) is controlled by a modulation of applied voltage. As a result, 3D structures of diverse materials are successfully fabricated: the arched wire, the 3D wire-junction and woven structure, the structures corresponding to the letters “KERI”, the martial arts artist, and the mesh structure. We believe that this approach paves the way for efficient multi-material 3D printing with high spatial resolution, which will ultimately lead to important advancements in additive manufacturing.

 

Dept. of MSE / BK21+





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