세미나안내

[2018 04 09] 특별세미나 _Ph.D Seung Kwon Seol (KERI)

Multiple-materials 3D printing with Functional Inks for 3D Printed Electronics

관리자 | 2018.04.05 09:34 | 조회 340


Multiple-materials 3D printing with Functional Inks for 3D Printed Electronics

 

 Date: 2018. 04. 09(Mon) , 15:30 ~ 17:00

 Place: Science Building, Room.102 Multimedia Room

 Speaker: Ph.D Seung Kwon Seol (KERI)

Host of a Seminar: Prof. Unyong Jeong

Abstract:

 

“Printed electronics” is the term used to describe electronic circuits and devices, such as RFID tag antennas, sensors, transistors, batteries, and conductive traces that are manufactured via printing techniques. Conventional printing techniques such as screen, gravure, and inkjet printing, offer a rapid and cheap way of fabricating electrical circuits on diverse flexible substrates. Furthermore, the advances in functional nanomaterials, which are included in the ink, have led to the rapid development of printed electronics in recent years. To date, printed electronics have introduced excellent opportunities for the creation of advanced products, which are developed by adding electronic functions to flexible substrates composed of materials such as plastics, rubber, or paper. However, conventional printing methods are limited to the patterning of two-dimensional (2D) or low aspect-ratio structures on flat substrates only, whereas three-dimensional (3D) patterning on non-flat substrates is essential for advanced applications.

3D printing, also known as additive manufacturing, is widely regarded as a revolution in manufacturing technology, with significant promise for electronic applications; this field is known as 3D printed electronics. However, it is difficult to obtain functional 3D structures for electronics, although we can easily produce plastic or metallic 3D objects with coarse resolution via various commercial 3D printing methods, such as stereolithography (SLA), fused deposition modeling (FDM), or selective laser sintering (SLS). Finding the appropriate printing approach for the achievement of functional 3D structures with high spatial resolution remains one of the major challenges in the field of 3D printed electronics.

Here, we demonstrate a novel strategy for multiple-materials 3D printing at room temperature in ambient air conditions. The 3D micro- and nanoarchitectures are printed by an omnidirectional accurate control of a micropipette (“fountain-pen”) filled with a solution (“ink”). A simple modulation of the ink leads to 3D printing for multiple-materials, such as

graphene, carbon nanotube (CNT), metal oxide, metal and even their composite. The employed printing technique is based on the simple procedure: when the fountain-pen touches the substrate, a meniscus of the ink is created outside its opening and the solvent is evaporated at the same time. As the fountain-pen is pulled away, the meniscus is stretched and its cross section decreases. In case of conducting polymer, CNT, graphene, silver and their composite, microarchitectures are formed by a van der waals force between substances during solvent evaporation. On the other hands, 3D copper microstructures are fabricated by a meniscus-guided electrodeposition. The feature of grown metallic structure (i.e. dense or hollow feature) is controlled by a modulation of applied voltage. As a result, 3D structures of diverse materials are successfully fabricated: the arched wire, the 3D wire-junction and woven structure, the structures corresponding to the letters “KERI”, the martial arts artist, and the mesh structure. We believe that this approach paves the way for efficient multi-material 3D printing with high spatial resolution, which will ultimately lead to important advancements in additive manufacturing.

 

Dept. of MSE / BK21+





219개(1/11페이지)
세미나안내
번호 제목 글쓴이 조회 날짜
219 [2018 12 12] 정기세미나 11th 첨부파일 관리자 35 2018.12.10 09:12
218 [2018 12 05] 정기세미나 10th 첨부파일 관리자 75 2018.12.05 08:59
217 [2018 11 28] 정기세미나 9th 첨부파일 관리자 284 2018.11.26 09:36
216 [2018 11 21] 정기세미나 8th 첨부파일 관리자 346 2018.11.19 09:47
215 [2018 11 14] 정기세미나 7th 첨부파일 관리자 447 2018.11.12 09:09
214 [2018 11 08] 특별세미나 _Prof. Jongwook KIM ( 첨부파일 관리자 567 2018.11.06 09:13
213 [2018 11 07] 정기세미나 6th 첨부파일 관리자 413 2018.11.05 09:14
212 [2018 10 31] 정기세미나 5th 첨부파일 관리자 540 2018.10.26 13:41
211 [2018 10 17] 정기세미나 4th 첨부파일 관리자 620 2018.10.15 14:14
210 [2018 10 10] 정기세미나 3rd 첨부파일 관리자 592 2018.10.05 15:40
209 [2018 09 19] 정기세미나 2nd 첨부파일 관리자 874 2018.09.17 12:16
208 [2018 09 12] 정기세미나 1st 첨부파일 관리자 851 2018.09.10 09:23
207 [2018 09 05] 신소재공학과 특별세미나 관리자 767 2018.09.03 11:24
206 [2018 08 17] 특별세미나 _Prof. Taishi Takenob 첨부파일 관리자 800 2018.08.14 08:49
205 [2018 05 30] 정기세미나 13th (박찬경 교수 정년퇴임 기념 첨부파일 관리자 794 2018.05.28 09:16
204 [2018 05 23] 정기세미나 12th 첨부파일 관리자 659 2018.05.21 09:11
203 [2018 05 16] 정기세미나 11th 첨부파일 관리자 562 2018.05.14 09:37
202 [2018 05 11] 특별세미나 _Ph. D Haeshin Lee (K 첨부파일 관리자 592 2018.05.10 09:31
201 [2018 05 09] 정기세미나 10th 첨부파일 관리자 375 2018.05.08 09:07
200 [2018 05 04] 특별세미나 _Dr. Hyobin Yoo (Harv 첨부파일 관리자 500 2018.05.03 09:48